TY  - JOUR
AB  - Purpose This paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates.Design/methodology/approach Bi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation.Findings It was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics.Originality/value The addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa.
VL  - 29
IS  - 3
SN  - 0954-0911
DO  - 10.1108/SSMT-08-2016-0018
UR  - https://doi.org/10.1108/SSMT-08-2016-0018
AU  - Kolenak Roman
PY  - 2017
Y1  - 2017/01/01
TI  - Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition
T2  - Soldering & Surface Mount Technology
PB  - Emerald Publishing Limited
SP  - 121
EP  - 132
Y2  - 2024/04/25
ER  -