TY  - JOUR
AB  - Purpose This paper aims to inspect the defects of solder joints of printed circuit board in real-time production line, simple computing and high accuracy are primary consideration factors for feature extraction and classification algorithm.Design/methodology/approach In this study, the author presents an ensemble method for the classification of solder joint defects. The new method is based on extracting the color and geometry features after solder image acquisition and using decision trees to guarantee the algorithm’s running executive efficiency. To improve algorithm accuracy, the author proposes an ensemble method of random forest which combined several trees for the classification of solder joints.Findings The proposed method has been tested using 280 samples of solder joints, including good and various defect types, for experiments. The results show that the proposed method has a high accuracy.Originality/value The author extracted the color and geometry features and used decision trees to guarantee the algorithm's running executive efficiency. To improve the algorithm accuracy, the author proposes using an ensemble method of random forest which combined several trees for the classification of solder joints. The results show that the proposed method has a high accuracy.
VL  - 29
IS  - 3
SN  - 0954-0911
DO  - 10.1108/SSMT-08-2016-0016
UR  - https://doi.org/10.1108/SSMT-08-2016-0016
AU  - Wu Hao
PY  - 2017
Y1  - 2017/01/01
TI  - Solder joint defect classification based on ensemble learning
T2  - Soldering & Surface Mount Technology
PB  - Emerald Publishing Limited
SP  - 164
EP  - 170
Y2  - 2024/04/24
ER  -