Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

Abstract

Purpose

The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge.

Design/methodology/approach

The melting characteristic of the lead-free alloys was studied using differential scanning calorimetry. Wettability was examined using wetting balance test for two liquid fluxes, water based and alcohol based in two temperatures 265°C and 277°C. Also, contact angle was measured using sessile drop test.

Findings

It is shown that 0.2 wt.% Sb reduces the melting temperature and pasty range. Moreover, the addition of 0.2 wt.% Sb improves wetting behavior for alcohol-based flux. It is also demonstrated that the effect of Sb on meniscus height in wetting balance test and contact angle in sessile drop test follows the trend of wetting performance.

Originality/value

It is found that adding 0.2 wt.% Sb improves the wettability of Ni-Ge micro-alloyed Sn-Cu solder; however, higher concentration of Sb does not benefit the alloy.

Citation

Nobari, A.H., Maalekian, M., Seelig, K. and Pekguleryuz, M. (2016), "Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge", Soldering & Surface Mount Technology, Vol. 28 No. 2, pp. 93-100. https://doi.org/10.1108/SSMT-08-2015-0023