Influence of the soldering paste type on optical and thermal parameters of LED modules
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 14 January 2022
Issue publication date: 17 June 2022
Abstract
Purpose
This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.
Design/methodology/approach
The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.
Findings
It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.
Practical implications
The obtained results of investigations can be usable for designers of the assembly process of power LED modules.
Originality/value
This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.
Keywords
Acknowledgements
This paper was partially supported by the Polish Ministry of Science and Higher Education within the framework of subvention for science in 2021 (No. 16.16.230.434) for AGH Faculty of Computer Science, Electronics and Telecommunications (Dr Barbara Dziurdzia) and the project called “Regionalna Inicjatywa Doskonałości” in the years 2019–2022, project number 006/RID/2018/19, the sum of financing 11,870,000 PLN. (Prof Krzysztof Górecki and Dr Przemysław Ptak).
Citation
Górecki, K., Ptak, P. and Dziurdzia, B. (2022), "Influence of the soldering paste type on optical and thermal parameters of LED modules", Soldering & Surface Mount Technology, Vol. 34 No. 4, pp. 230-238. https://doi.org/10.1108/SSMT-07-2021-0043
Publisher
:Emerald Publishing Limited
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