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An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

Feng Wang (Department of Mechanical Engineering, Wenzhou Polytechnic, Wenzhou, China)
Fangfang Zhang (Department of Information Technology, Wenzhou Polytechnic, Wenzhou, China)
Qixiang Huang (Department of Mechanical Engineering, Wenzhou Polytechnic, Wenzhou, China)
Mohammad Salmani (Payame Noor University, Tehran, Islamic Republic of Iran)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 11 November 2020

Issue publication date: 17 May 2021

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Abstract

Purpose

The purpose of this paper is to propose a method with capability of short-time implementation.

Design/methodology/approach

This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.

Findings

A new method with good agreement with experimental tests has been proposed.

Originality/value

It is confirmed that paper is original.

Keywords

Acknowledgements

National Natural Science Foundation of China under Grant Nos.51705302.

Citation

Wang, F., Zhang, F., Huang, Q. and Salmani, M. (2021), "An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 170-177. https://doi.org/10.1108/SSMT-07-2020-0031

Publisher

:

Emerald Publishing Limited

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