The purpose of this paper is to propose a method with capability of short-time implementation.
This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.
A new method with good agreement with experimental tests has been proposed.
It is confirmed that paper is original.
National Natural Science Foundation of China under Grant Nos.51705302.
Wang, F., Zhang, F., Huang, Q. and Salmani, M. (2021), "An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 170-177. https://doi.org/10.1108/SSMT-07-2020-0031
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