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Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

Mohammad Gharaibeh (Department of Mechanical Engineering, Hashemite University, Zarqa, Jordan)
Aaron J. Stewart (Department of Mechanical Engineering, Binghamton University, Binghamton, New York, USA)
Quang T. Su (Department of Mechanical Engineering, Binghamton University, Binghamton, New York, USA)
James M. Pitarresi (Department of Mechanical Engineering, Binghamton University, Binghamton, New York, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 22 November 2018

Issue publication date: 16 April 2019

170

Abstract

Purpose

This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions.

Design/methodology/approach

Reliability tests were conducted using a sine dwell with resonance tracking vibration experiment. Finite element simulations were performed to help in understanding the observed failure trends.

Findings

Reliability results showed that the tin-lead solders out-perform lead-free solders in vibrations loading. Additionally, the LGA solder type could provide a better vibration reliability performance than BGA solders. Failure analysis results showed that in LGAs, the crack is initiated at the printed circuit board side and at the component side in BGAs. In both types, the crack is propagated throughout in the intermetallic compound layer.

Originality/value

In literature, there is a lack of published data in the comparison between LGA and BGA reliability performance in vibration loadings. This paper provides useful insights in the vibration reliability behavior of the two common solder joint types.

Keywords

Acknowledgements

This work was funded by the Universal Instruments Corporation, Conklin, NY, USA. The authors also thank Mike Meilunas for his help in test vehicle assembly.

Citation

Gharaibeh, M., Stewart, A.J., Su, Q.T. and Pitarresi, J.M. (2019), "Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys", Soldering & Surface Mount Technology, Vol. 31 No. 2, pp. 77-84. https://doi.org/10.1108/SSMT-07-2018-0020

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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