This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC).
This paper includes experiments and finite element simulation.
The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC.
The Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated.
This study was funded by the Natural Science Foundation of China (51475220), the Qing Lan Project, the China Postdoctoral Science Foundation funded project (2016M591464) and the State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering) (SKLABFMT-2015-03).
Zhang, L., Liu, Z.-q., Yang, F. and Zhong, S.-j. (2017), "Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC", Soldering & Surface Mount Technology, Vol. 29 No. 3, pp. 151-155. https://doi.org/10.1108/SSMT-07-2016-0015
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