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Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Liang Zhang (School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, China and Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China)
Zhi-quan Liu (Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China)
Fan Yang (School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, China)
Su-juan Zhong (State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 5 June 2017

Abstract

Purpose

This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC).

Design/methodology/approach

This paper includes experiments and finite element simulation.

Findings

The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC.

Originality/value

The Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated.

Keywords

Acknowledgements

This study was funded by the Natural Science Foundation of China (51475220), the Qing Lan Project, the China Postdoctoral Science Foundation funded project (2016M591464) and the State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering) (SKLABFMT-2015-03).

Citation

Zhang, L., Liu, Z.-q., Yang, F. and Zhong, S.-j. (2017), "Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC", Soldering & Surface Mount Technology, Vol. 29 No. 3, pp. 151-155. https://doi.org/10.1108/SSMT-07-2016-0015

Publisher

:

Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited