TY  - JOUR
AB  - Purpose Reflow soldering process is an important step of the surface mount technology. The purpose of this paper is to minimize the maximum warpage of shielding frame by controlling reflow soldering control parameters.Design/methodology/approach Compared with other reflow-related design methods, both time and temperate of each extracted time region are considered. Therefore, the number of design variable is increased. To solve the high-dimensional problem, a surrogate-assisted optimization (SAO) called adaptive Kriging high-dimensional representation model (HDMR) is used.Findings Therefore, the number of design variable is increased. To solve the high-dimensional problem, a surrogate-assisted optimization (SAO) called HDMR is used. The warpage of shield frame is significantly reduced. Moreover, the correlations of design variables are also disclosed.Originality/value Compared with the original Kriging HDMR, the expected improvement (EI) criterion is used and a new projection strategy is suggested to improve the efficiency of optimization method. The application suggests that the adaptive Kriging HDMR has potential capability to solve such complicated engineering problems.
VL  - 28
IS  - 2
SN  - 0954-0911
DO  - 10.1108/SSMT-07-2015-0021
UR  - https://doi.org/10.1108/SSMT-07-2015-0021
AU  - Chen Liming
AU  - Li Enying
AU  - Wang Hu
PY  - 2016
Y1  - 2016/01/01
TI  - Time-based reflow soldering optimization by using adaptive Kriging-HDMR method
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
SP  - 101
EP  - 113
Y2  - 2024/04/25
ER  -