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Research and prospect of binary high-temperature Pb-free solders

Yunfei Du (School of Language Studies, Chongqing University of Technology, Chongqing, P.R. China)
Chuntian Li (School of Materials Science and Engineering, Chongqing University of Technology, Chongqing, P.R. China)
Bin Huang (School of Language Studies, Chongqing University of Technology, Chongqing, P.R. China)
Ming Tang (School of Materials Science and Engineering, Chongqing University of Technology, Chongqing, P.R. China)
Changhua Du (School of Materials Science and Engineering, Chongqing University of Technology, Chongqing, P.R. China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 2 February 2015

Abstract

Purpose

This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high temperature Sn-Pb solder.

Design/methodology/approach

The basis of the paper is the synthesis of previous studies. In terms of some binary high temperature solder alloys, such as Au-20Sn, Bi-2.5Ag, Sn-5Sb, Au-12.5Ge, Zn-6Al and Zn-Sn, taking the alloy phase diagram as the starting point, the melting characteristics, microstructure, mechanical properties, wetting ability and reliability of solder joint are analysed and the prospect is consequently indicated.

Findings

Based on the analysis of the six groups of Pb-free solders, the present binary system solder alloys, from the perspective of melting properties, mechanical properties, soldering or reliability of solder joint, rarely meet the comprehensive requirements of replacing the high-temperature Sn-Pb solder. It is assumed to be a solution that multiple-system Pb-free solders derive from a variety of binary system solders by means of alloying. The future development of high temperature Pb-free solder may focus on some factors such as physical properties, mechanical properties, processing, reliability of solder joint, environmental performance and expense.

Originality/value

The paper concentrates on the issue of Pb-free solders at high temperature. From a specific perspective of binary system solders, the presently available Pb-free solders are suggested from the starting point of the alloy phase diagram and the prospect of alternatives of Sn-Pb solders at high temperature are indicated.

Keywords

Acknowledgements

This paper is supported by the outstanding achievements from transformation projects (KJZH11215) of higher education in Chongqing, China. It is a deepest gratitude to Changhua Du, leader of the project and other people who has participated in the project and paper writing.

Citation

Du, Y., Li, C., Huang, B., Tang, M. and Du, C. (2015), "Research and prospect of binary high-temperature Pb-free solders", Soldering & Surface Mount Technology, Vol. 27 No. 1, pp. 7-12. https://doi.org/10.1108/SSMT-07-2014-0015

Publisher

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Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited