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Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

Peter K. Bernasko (Electronics Manufacturing Engineering Research Group, School of Engineering at Medway, University of Greenwich, Chatham Maritime, UK)
Sabuj Mallik (Electronics Manufacturing Engineering Research Group, School of Engineering at Medway, University of Greenwich, Chatham Maritime, UK)
G. Takyi (Department of Mechanical Engineering, Kwame Nkrumah University of Science and Technology, Kumasi, Ghana)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 2 February 2015

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Abstract

Purpose

The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.

Design/methodology/approach

To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).

Findings

It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.

Research limitations/implications

A proper correlation between shear strength and fracture mode is required.

Practical implications

The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.

Originality/value

The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Keywords

Acknowledgements

The authors acknowledge the support of EMERG and University of Greenwich and staff/researchers for the work reported in this paper.

Citation

Bernasko, P.K., Mallik, S. and Takyi, G. (2015), "Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint", Soldering & Surface Mount Technology, Vol. 27 No. 1, pp. 52-58. https://doi.org/10.1108/SSMT-07-2013-0019

Publisher

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Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited