The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.
To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).
It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.
A proper correlation between shear strength and fracture mode is required.
The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.
The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.
The authors acknowledge the support of EMERG and University of Greenwich and staff/researchers for the work reported in this paper.
Bernasko, P.K., Mallik, S. and Takyi, G. (2015), "Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint", Soldering & Surface Mount Technology, Vol. 27 No. 1, pp. 52-58. https://doi.org/10.1108/SSMT-07-2013-0019Download as .RIS
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