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Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Lina Syazwana Kamaruzzaman (Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia)
Yingxin Goh (Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 4 April 2022

Issue publication date: 23 September 2022

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Abstract

Purpose

This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys.

Design/methodology/approach

A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder.

Findings

The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties.

Originality/value

This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

Keywords

Acknowledgements

The authors would like to convey special thanks for the financial support provided through the University Malaya Faculty Research Grant (GPF046A-2019).

Conflict of interest: On behalf of all authors, the corresponding author states that there is no conflict of interest.

Citation

Kamaruzzaman, L.S. and Goh, Y. (2022), "Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review", Soldering & Surface Mount Technology, Vol. 34 No. 5, pp. 300-318. https://doi.org/10.1108/SSMT-06-2021-0035

Publisher

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Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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