Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 4 April 2022
Issue publication date: 23 September 2022
Abstract
Purpose
This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys.
Design/methodology/approach
A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder.
Findings
The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties.
Originality/value
This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.
Keywords
Acknowledgements
The authors would like to convey special thanks for the financial support provided through the University Malaya Faculty Research Grant (GPF046A-2019).
Conflict of interest: On behalf of all authors, the corresponding author states that there is no conflict of interest.
Citation
Kamaruzzaman, L.S. and Goh, Y. (2022), "Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review", Soldering & Surface Mount Technology, Vol. 34 No. 5, pp. 300-318. https://doi.org/10.1108/SSMT-06-2021-0035
Publisher
:Emerald Publishing Limited
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