Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Soldering & Surface Mount Technology
Article publication date: 16 November 2020
Issue publication date: 17 May 2021
This paper aims to establish a more accurate model for lifetime estimation.
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
A more precise model was found.
It is confirmed that the paper is original.
Zhang, B., Jabarullah, N.H., Alkaim, A.F., Danshina, S., Krasnopevtseva, I.V., Zheng, Y. and Geetha, N. (2021), "Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 187-194. https://doi.org/10.1108/SSMT-06-2020-0028
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