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Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

Buen Zhang (College of Water Conservancy and Hydropower Engineering, Hohai University,, Jiangsu, China)
Noor H. Jabarullah (Universiti Kuala Lumpur Malaysian Institute of Aviation Technology, Selangor, Malaysia)
Ayad F. Alkaim (University of Babylon, Hilla, Iraq)
Svetlana Danshina (I.M. Sechenov First Moscow State Medical University (Sechenov University) Department of Propaedeutics of Dental Diseases, Moskva, Russian Federation)
Irina V. Krasnopevtseva (Togliatti State University, Tolyatti, Russia)
Yuan Zheng (College of Energy and Electrical Engineering, Hohai University, Jiangsu, China)
Nisith Geetha (Department of Electrical and Electronics Engineering, Sengunthar Engineering College, Tiruchengode, India)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 16 November 2020

Issue publication date: 17 May 2021

125

Abstract

Purpose

This paper aims to establish a more accurate model for lifetime estimation.

Design/methodology/approach

Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.

Findings

A more precise model was found.

Originality/value

It is confirmed that the paper is original.

Keywords

Citation

Zhang, B., Jabarullah, N.H., Alkaim, A.F., Danshina, S., Krasnopevtseva, I.V., Zheng, Y. and Geetha, N. (2021), "Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 187-194. https://doi.org/10.1108/SSMT-06-2020-0028

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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