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An investigation on function of current type on solder joint degradation in electronic packages

Wenhui Cai (Engineering Training and Teaching Center, Northeast Electric Power University, Jilin City, Jilin Province, China)
Fei Huang (Engineering Training and Teaching Center, Northeast Electric Power University, Jilin City, Jilin Province, China)
Kai Liu (Automotive Engineering Institute, Jilin Technology College of Electronic Information, Jilin City, Jilin Province, China)
Mohammed Alaazim (Faculty of Engineering, Universitas Muhammadiyah Surakarta (UMS), Indonesia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 23 September 2020

Abstract

Purpose

As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider.

Design/methodology/approach

In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance.

Findings

The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type.

Originality/value

The originality of this paper is confirmed.

Keywords

Acknowledgements

The study was supported by “Jilin City Science and Technology Innovation and Development Plan Project, China (Grant No. 20190104143)”.

Citation

Cai, W., Huang, F., Liu, K. and Alaazim, M. (2020), "An investigation on function of current type on solder joint degradation in electronic packages", Soldering & Surface Mount Technology, Vol. 33 No. 2, pp. 105-111. https://doi.org/10.1108/SSMT-06-2020-0025

Publisher

:

Emerald Publishing Limited

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