Advanced
search

To read this content please select one of the options below:

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusmawati Wan Yusoff (Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Wilayah Persekutuan, Malaysia)
Norliza Ismail (Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia)
Nur Shafiqa Safee (Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Wilayah Persekutuan, Malaysia)
Ariffin Ismail (Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Wilayah Persekutuan, Malaysia)
Azman Jalar (Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia)
Maria Abu Bakar (Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 2 April 2019

Issue publication date: 16 April 2019

101

Abstract

Purpose

The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.

Design/methodology/approach

Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach.

Findings

Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight.

Originality/value

Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications.

Keywords

Acknowledgements

The authors gratefully acknowledge the financial supported by the Fundamental Research Grant Scheme (Grant. No. FRGS/1/2015/SG06/UPNM/03/1) provided by the Ministry of Higher Education of Malaysia, Universiti Pertahanan Nasional Malaysia (UPNM), Universiti Kebangsaan Malaysia (UKM) and Redring Solder (M) Sdn. Bhd. for research materials and collaboration work.

Citation

Wan Yusoff, W.Y., Ismail, N., Safee, N.S., Ismail, A., Jalar, A. and Abu Bakar, M. (2019), "Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition", Soldering & Surface Mount Technology, Vol. 31 No. 2, pp. 102-108. https://doi.org/10.1108/SSMT-06-2018-0019

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

Related articles

Manage cookies

We’re listening — tell us what you think

Join us on our journey