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Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions

Wangyun Li (School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
Linqiang Liu (School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
Xingmin Li (School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 20 July 2022

Issue publication date: 28 February 2023

68

Abstract

Purpose

This study aims to experimentally assess the effect of thickness and preparation direction on the damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders.

Design/methodology/approach

Sn58Bi and Sn3.0Ag0.5Cu solder strips with different thicknesses were prepared from the bulk in longitudinal and horizontal directions, and the ratio of loss modulus and storage modulus of the samples was measured by the dynamic mechanical analysis method as the index of damping properties.

Findings

Sn58Bi and Sn3.0Ag0.5Cu solders exhibited viscoelastic relaxation, and their damping properties decreased with decreasing thickness. The damping properties of both solders had no obvious difference in longitudinal and horizontal directions. Sn58Bi has a more obvious high-temperature damping background than Sn3.0Ag0.5Cu solder. In addition, compared with Sn58Bi solder, Sn3.0Ag0.5Cu solder had an obvious internal friction peak, which moved toward high temperature with increasing frequency. The activation energies of Sn58Bi solder with a thickness of 0.5 mm at the longitudinal and horizontal directions were 0.84 and 0.67 eV, respectively, which were 0.39 and 0.53 eV, respectively, for the Sn3.0Ag0.5Cu solder.

Originality/value

The damping properties of Sn58Bi and Sn3.0Ag0.5Cu solder decreased with decreasing thickness, while their damping properties changed insignificantly when they were prepared from different directions. The internal friction peak of Sn3.0Ag0.5Cu solder moved to higher temperatures with increasing frequency.

Keywords

Acknowledgements

The authors thank the support by the National Natural Science Foundation of China under Grant No. 51805103, Science and Technology Plan Project of Liudong New District under Grant No. Liudongkegong20210106, Innovation Project of Guangxi Graduate Education Nos. YCSW2021184 and JGY2021084, and Innovation Project of GUET Graduate Education Grant No. 2022YCXS007.

Citation

Li, W., Liu, L. and Li, X. (2023), "Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions", Soldering & Surface Mount Technology, Vol. 35 No. 2, pp. 86-94. https://doi.org/10.1108/SSMT-05-2022-0043

Publisher

:

Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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