TY  - JOUR
AB  - Purpose This study aims to investigate the vibration effects on ball grid array lifetime.Design/methodology/approach Several finite element method simulations and experiments were performed.Findings An optimized circuit configuration was found.Originality/value The originality of paper is confirmed by authors.
VL  - 33
IS  - 1
SN  - 0954-0911
DO  - 10.1108/SSMT-05-2020-0020
UR  - https://doi.org/10.1108/SSMT-05-2020-0020
AU  - Gao Yang
AU  - Wang Fuwei
AU  - Ding Shaohu
AU  - Yang Bin
AU  - Liu Lin
AU  - Salmani Mohammad
PY  - 2020
Y1  - 2020/01/01
TI  - Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies
T2  - Soldering & Surface Mount Technology
PB  - Emerald Publishing Limited
SP  - 1
EP  - 7
Y2  - 2024/05/10
ER  -