This study aims to investigate the vibration effects on ball grid array lifetime.
Several finite element method simulations and experiments were performed.
An optimized circuit configuration was found.
The originality of paper is confirmed by authors.
This project is supported by National Natural Science Foundation of China (Grant No. 51765001, 11764002) and Key research projects of North Minzu University in 2019 (Grant No. 2019KJ35, 2019KJ34).
Gao, Y., Wang, F., Ding, S., Yang, B., Liu, L. and Salmani, M. (2020), "Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies", Soldering & Surface Mount Technology, Vol. 33 No. 1, pp. 1-7. https://doi.org/10.1108/SSMT-05-2020-0020Download as .RIS
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