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Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Yang Gao (North Minzu University, Yinchuan, China)
Fuwei Wang (University of Kansas, Lawrence, Kansas, USA)
Shaohu Ding (North Minzu University, Yinchuan, China)
Bin Yang (North Minzu University, Yinchuan, China)
Lin Liu (University of Kansas, Lawrence, Kansas, USA)
Mohammad Salmani (Payame Noor University, Tehran, Iran)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 14 October 2020

Issue publication date: 4 January 2021

137

Abstract

Purpose

This study aims to investigate the vibration effects on ball grid array lifetime.

Design/methodology/approach

Several finite element method simulations and experiments were performed.

Findings

An optimized circuit configuration was found.

Originality/value

The originality of paper is confirmed by authors.

Keywords

Acknowledgements

This project is supported by National Natural Science Foundation of China (Grant No. 51765001, 11764002) and Key research projects of North Minzu University in 2019 (Grant No. 2019KJ35, 2019KJ34).

Citation

Gao, Y., Wang, F., Ding, S., Yang, B., Liu, L. and Salmani, M. (2021), "Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies", Soldering & Surface Mount Technology, Vol. 33 No. 1, pp. 1-7. https://doi.org/10.1108/SSMT-05-2020-0020

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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