Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 28 December 2020
Issue publication date: 17 May 2021
Abstract
Purpose
The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.
Design/methodology/approach
In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.
Findings
It was found that inverter types highly affect the solder joint health during its nominal operating.
Originality/value
The authors confirm the originality of this paper.
Keywords
Acknowledgements
Science and technology project of Sichuan market supervision and Administration Bureau (SCSJ202001).
Citation
Zou, H., Xie, F., Du, B. and Kavithaa, G. (2021), "Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 141-150. https://doi.org/10.1108/SSMT-05-2020-0018
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited