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Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

Hao Zou (Sichuan Special Equipment Inspection and Research Institute, Chengdu, China)
Fang Xie (Sichuan Special Equipment Inspection and Research Institute, Chengdu, China)
Bo Du (Sichuan Special Equipment Inspection and Research Institute, Chengdu, China)
G. Kavithaa (Government College of Engineering, Salem, India)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 December 2020

Issue publication date: 17 May 2021

76

Abstract

Purpose

The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.

Design/methodology/approach

In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.

Findings

It was found that inverter types highly affect the solder joint health during its nominal operating.

Originality/value

The authors confirm the originality of this paper.

Keywords

Acknowledgements

Science and technology project of Sichuan market supervision and Administration Bureau (SCSJ202001).

Citation

Zou, H., Xie, F., Du, B. and Kavithaa, G. (2021), "Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 141-150. https://doi.org/10.1108/SSMT-05-2020-0018

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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