Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate

Abstract

Purpose

This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were soldered in between copper substrates and flux was applied. The mechanical tests carried out on the solder alloys were tensile and shear tests. They were experimented on with different fluxes, namely, water-soluble (paste), rosin mildly activated (RMA) and insoluble (RMA) flux. From these experiments, the ultimate tensile strength, shear strength, elongation, yield stress, Young’s modulus and the stress-strain curve are derived. The results showed that solder billets that were soldered onto copper substrates with water-soluble flux yielded the highest ultimate tensile strength and shear strength values of 9.9961 MPa and 118.836 MPa, respectively. Billets soldered using RMA flux had the highest values of elongation and Young’s modulus, 0.306 mm and 50,257.295 MPa, respectively. However, on viewing the failure of all the specimens under an optical microscope and scanning electron microscope (SEM), specimens soldered using water-soluble flux possessed the least deformities, depicting their higher level of mechanical properties, entailing their strength and ductility, deeming them as the most suitable flux for microelectronic applications.

Design/methodology/approach

The solder billets were soldered in between copper substrates and flux was applied. The mechanical tests carried out on the solder alloys were tensile and shear tests. They were experimented on with different fluxes, namely, water-soluble (paste), RMA and insoluble flux (RMA) flux. From these experiments, the ultimate tensile strength, shear strength, elongation, yield stress, Young’s modulus and the stress-strain curve are derived.

Findings

The results showed that solder billets that were soldered onto copper substrates with water-soluble flux yielded the highest ultimate tensile strength and shear strength values of 9.9961 MPa and 118.836 MPa, respectively.

Originality/value

This paper demonstrated that water-soluble fluxes gave the better strength and were most suitable for microelectronics applications.

Citation

Mhd Noor, E.E. and Ogundipe, A.S. (2017), "Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate", Soldering & Surface Mount Technology, Vol. 29 No. 4, pp. 225-234. https://doi.org/10.1108/SSMT-05-2017-0014