Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Abstract

Purpose

This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy.

Design/methodology/approach

Ternary melt-spun Sn-Ag-Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry.

Findings

The results revealed that the Ag₃Sn intermetallic compound (IMC) and ß-Sn have been refined because of the hard inclusions’ (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn_96.4-Ag_3.5-Cr_0.1 alloy showed an improvement in Young’s modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic Sn-Ag alloy due to the high concentration of Ag₃Sn and their uniform distribution. Shortage in the internal friction (Q⁻¹) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag₃Sn formation led to low toughness values compared to the eutectic Sn-Ag alloy, which may have resulted from the mismatching among hexagonal Ag₃Sn phase with orthorhombic Ag₃Sn and ß-Sn phases. Mechanically, the values of Young’s modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn_95.8-Ag_3.5-Cr_0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 × 10⁻⁴) compared to the other alloys. Increase in the melting temperature T_m, ΔH, C_p and ΔT was because of Ag₃Sn IMC formation. The low toughness of Sn₉₆-Ag_3.5-Cr_0.5 and Sn_95.8-Ag_3.5-Cr_0.7 (109.56 J/m³ and 35.66 J/m³), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m⁻¹.k⁻¹ and 0.314 m²/s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with “0.1 Wt.%” of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly.

Originality/value

This study provides chromium effects on the structure of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.

Citation

Abbas, S.R., Gumaan, M.S. and Shalaby, R.M. (2020), "Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy", Soldering & Surface Mount Technology, Vol. 32 No. 3, pp. 137-145. https://doi.org/10.1108/SSMT-04-2019-0017