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Effect of different soldering temperatures on the properties of COB light source

Zhao Wang (Shanghai Institute of Technology, Shanghai, China)
Yuefeng Li (Shanghai Institute of Technology, Shanghai, China)
Jun Zou (Shanghai Institute of Technology, Shanghai, China)
Bobo Yang (Shanghai Institute of Technology, Shanghai, China)
Mingming Shi (Shanghai Institute of Technology, Shanghai, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 August 2021

Issue publication date: 17 February 2022

57

Abstract

Purpose

The purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.

Design/methodology/approach

First, the influence of the void ratio of the COB light source on the steady-state voltage, luminous flux, luminous efficiency and junction temperature has been explored at soldering temperatures of 250°C, 260°C, 270°C, 280°C and 290°C. The COB chip has also been tested for practical application and aging.

Findings

The results show that when the soldering temperature is 270°C, the void ratio of the soldering layer is only 5.1%, the junction temperature of the chip is only 76.52°C, and the luminous flux and luminous efficiency are the highest, and it has been observed that the luminous efficiency and average junction temperature of the chip are 107 lm/W and 72.3°C, respectively, which meets the requirements of street lights. After aging for 1,080 h, the light attenuation is 84.64% of the initial value, which indicates that it has higher reliability and longer life.

Originality/value

It can provide reference data for readers and people in this field and can be directly applied to practical engineering.

Keywords

Acknowledgements

Conflict of interest: The authors declare that they have no conflict of interest.

Citation

Wang, Z., Li, Y., Zou, J., Yang, B. and Shi, M. (2022), "Effect of different soldering temperatures on the properties of COB light source", Soldering & Surface Mount Technology, Vol. 34 No. 2, pp. 88-95. https://doi.org/10.1108/SSMT-03-2021-0010

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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