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Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

Muhammad Aamir (Mechanical Engineering Department, CECOS University of IT and Emerging Sciences, Peshawar, Pakistan)
Izhar (Mechanical Engineering Department, CECOS University of IT and Emerging Sciences, Peshawar, Pakistan)
Muhammad Waqas (Electronic Engineering Department, Tsinghua University, Beijing, China)
Muhammad Iqbal (Mechanical Engineering Department, University of Engineering and Technology, Peshawar, Pakistan)
Muhammad Imran Hanif (Mechanical Engineering Department, CECOS University of IT and Emerging Sciences, Peshawar, Pakistan)
Riaz Muhammad (Mechanical Engineering Department, CECOS University of IT and Emerging Sciences, Peshawar, Pakistan)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 4 September 2017

205

Abstract

Purpose

This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy, at different levels of temperature. The reliability of solder joint in materials selection is critical in terms of temperature, mechanical properties and environmental aspects. Owing to a wide range of soldering materials available, the selection space finds a fuzzy characteristic.

Design/methodology/approach

The developed algorithm takes thermal aging temperature for SAC305 alloy as input and converts it into fuzzy domain. These fuzzified values are then subjected to a fuzzy rule base, where a set of rules determines the IMC size and mechanical properties, such as yield strength (YS) and ultimate tensile strength (UTS) of SAC305 alloy. The algorithm is successfully simulated for various input thermal aging temperatures. To analyze and validate the developed algorithm, an SAC305 lead (Pb)-free solder alloy is developed and thermally aged at 40, 60 and 100°C temperature.

Findings

The experimental results indicate an average IMCs size of 5.967 (in Pixels), 19.850 N/mm2 YS and 22.740 N/mm2 UTS for SAC305 alloy when thermally aged at an elevated temperature of 140°C. In comparison, the simulation results predicted 5.895 (in Pixels) average IMCs size, 19.875 N/mm2 YS and 22.480 N/mm2 UTS for SAC305 alloy at 140°C thermally aged temperature.

Originality/value

From the experimental and simulated results, it is evident that the fuzzy-based developed algorithm can be used effectively to predict the IMCs size and mechanical properties of SAC305 at various aging temperatures, for the first time.

Keywords

Citation

Aamir, M., , I., Waqas, M., Iqbal, M., Hanif, M.I. and Muhammad, R. (2017), "Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy", Soldering & Surface Mount Technology, Vol. 29 No. 4, pp. 191-198. https://doi.org/10.1108/SSMT-02-2017-0005

Publisher

:

Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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