Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle
Abstract
Purpose
This paper aims to systematically study the effect of reinforcement type, processing methods and reflow cycle on actual retained ratio of foreign reinforcement added in solder joints.
Design/methodology/approach
Two kinds of composite solders based on SAC305 (wt.%) alloys with reinforcements of 1 wt.% Ni and 1 wt.% TiC nano-particles were produced using powder metallurgy and mechanical blending method. The morphology of prepared composite solder powder and solder pastes was examined; retained ratios of reinforcement (RRoR) added in solder joints after different reflow cycles were analysed quantitatively using an Inductively Coupled Plasma optical system (ICP-OES Varian-720). The existence forms of reinforcement added in solder alloys during different processing stages were studied using scanning electron microscope, X-ray diffractometry and energy dispersive spectrometry.
Findings
The obtained experimental results indicated that the RRoR in composite solder joints decreased with the increase in the number of reflow cycles, but a loss ratio diminished gradually. It was also found that the RRoR which could react with the solder alloy were higher than that of the one that are unable to react with the solder. In addition, compared with mechanical blending, the RRoRs in the composite solders prepared using power metallurgy were relatively pronounced.
Originality/value
Present study offer a preliminary understanding on actual content and existence form of reinforcement added in a reflowed solder joint, which would also provide practical implications for choosing reinforcement and adjusting processing parameters in the manufacture of composite solders.
Keywords
Acknowledgements
The authors acknowledge the research funding provided by the National Nature Science Foundation of China (NSFC) (NSFC No. 61261160498). This research was also supported by China-European Union technology cooperation project, No. 1,110, as well as the Marie Curie International Research Staff Exchange Scheme Project within the 7th European Community Framework Programme, No. PIRSES-GA-2010-269113, entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6)”.
Citation
Chen, G., Liu, L., Silberschmidt, V.V., Chan, Y.C., Liu, C. and Wu, F. (2016), "Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle", Soldering & Surface Mount Technology, Vol. 28 No. 3, pp. 159-166. https://doi.org/10.1108/SSMT-02-2016-0004
Publisher
:Emerald Group Publishing Limited
Copyright © 2016, Emerald Group Publishing Limited