Wetting properties of Nd:YAG laser treated copper by SAC solders
Abstract
Purpose
This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties.
Design/methodology/approach
The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper surface was analysed using optical microscopy and scanning electron microscopy (SEM).
Findings
The experimental results showed that the wetting contact angles changed with the variation in laser power. Furthermore, it means that the surface energy of copper plates was changed by the laser treatment. The results demonstrated that the contact angles also changed when a different soldering paste was used.
Originality/value
Previous laser surface treatment can be a possible way to optimize the wettability between solders and substrates and to increase the quality of the soldered joints.
Keywords
Acknowledgements
This research work was performed as part of the EFOP-3.6.1-16-2016-00014 project. The project is supported by the European Union, and co-financed by the European Social Fund, which is gratefully acknowledged.
Citation
Hlinka, J., Berczeli, M., Buza, G. and Weltsch, Z. (2017), "Wetting properties of Nd:YAG laser treated copper by SAC solders", Soldering & Surface Mount Technology, Vol. 29 No. 2, pp. 69-74. https://doi.org/10.1108/SSMT-01-2016-0003
Publisher
:Emerald Publishing Limited
Copyright © 2017, Emerald Publishing Limited