Towards understanding of ultrasonic consolidation process with “process map”

Abstract

Purpose

The purpose of this paper is to identify the key parameters that control the bonding formation of foils by the ultrasonic consolidation (UC) process and to build the correlations among process operating conditions and key control parameters through the concept of “process map”.

Design/methodology/approach

The concept of “process map” is proposed based on the diffusion bonding mechanism for the UC process, and numerical simulations have been applied to the UC process to predict peak temperature and plastic strain at the contact interface by considering a wide range of process operating conditions.

Findings

This map reveals that the formation of bonding among foils by the UC process requires a good match between temperature and plastic deformation at the contact interface. This limits the process operating window to a narrow region in the strain – temperature coordinate system.

Originality/value

This work has identified the underlying mechanism for bonding formation and the key control parameters of the UC process. The concept of “process map” for the UC process was developed, which allows the process optimization through two critical process control parameters of temperature and plastic strain at the contact interface instead of five operating conditions.

Citation

Zhang, S., Yi, D., Zhang, H., Zheng, L., Zhang, Y., Yang, Z. and Norfolk, M. (2015), "Towards understanding of ultrasonic consolidation process with “process map”", Rapid Prototyping Journal, Vol. 21 No. 4, pp. 461-468. https://doi.org/10.1108/RPJ-05-2014-0067