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A flash-based thermal simulation of scanning paths in LPBF additive manufacturing

Kamel Ettaieb (Université Paris-Saclay, ENS Paris-Saclay, Institut Farman, LURPA, Gif-sur-Yvette, France)
Sylvain Lavernhe (Université Paris-Saclay, ENS Paris-Saclay, Institut Farman, LURPA, Gif-sur-Yvette, France)
Christophe Tournier (Université Paris-Saclay, ENS Paris-Saclay, Institut Farman, LURPA, Gif-sur-Yvette, France)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 29 March 2021

Issue publication date: 4 June 2021

126

Abstract

Purpose

This paper aims to propose an analytical thermal three-dimensional model that allows an efficient evaluation of the thermal effect of the laser-scanning path. During manufacturing by laser powder bed fusion (LPBF), the laser-scanning path influences the thermo-mechanical behavior of parts. Therefore, it is necessary to validate the path generation considering the thermal behavior induced by this process to improve the quality of parts.

Design/methodology/approach

The proposed model, based on the effect of successive thermal flashes along the scanning path, is calibrated and validated by comparison with thermal results obtained by FEM software and experimental measurements. A numerical investigation is performed to compare different scanning path strategies on the Ti6Al4V material with different stimulation parameters.

Findings

The simulation results confirm the effectiveness of the approach to simulate the thermal field to validate the scanning strategy. It suggests a change in the scale of simulation thanks to high-performance computing resources.

Originality/value

The flash-based approach is designed to ensure the quality of the simulated thermal field while minimizing the computational cost.

Keywords

Acknowledgements

This work is supported by the SOFIA project and funded by Bpifrance.

Citation

Ettaieb, K., Lavernhe, S. and Tournier, C. (2021), "A flash-based thermal simulation of scanning paths in LPBF additive manufacturing", Rapid Prototyping Journal, Vol. 27 No. 4, pp. 720-734. https://doi.org/10.1108/RPJ-04-2020-0086

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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