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Investigation of the effects of a pre-deposition heating system on the interfacial temperature and interlayer bonding strength for fused filament fabrication

Piyush Suresh Mundada (Department of Mechanical Engineering, Washington State University, Pullman, Washington, USA)
Che-Hao Yang (Department of Mechanical Engineering, Washington State University – Tri-Cities, Richland, Washington, USA)
Roland K. Chen (School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington, USA)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 29 June 2022

Issue publication date: 2 January 2023

83

Abstract

Purpose

The purpose of this study is to propose the use of a pre-deposition heating system for fused filament fabrication (FFF) as a means to enhance interlayer bonding by elevating the substrate temperature. The effects of the heating on thermal profile at the bonding interface and the mechanical properties of three-dimensional printed parts are investigated.

Design/methodology/approach

A 12-W laser head is integrated to a commercial printer as the pre-deposition heating system. The laser beam heats up substate before the deposition of a fresh filament. Effects of laser powers are investigated and the thermal profile is measured with thermocouple, infrared camera and finite element model. The correlation between the temperature at the bonding interface and the bonding quality is investigated by conducting tensile testing and neck width measurement with microscope.

Findings

The pre-deposition heating system is proven to be effective in enhancing the inter-layer strength in FFF parts. Tensile testing of specimens along build direction (Z) shows an increase of around 50% in ultimate strength. A linear relationship is observed between the pre-deposition temperature at bond interface and bonding strength. It is evident that elevating the pre-deposition temperature promotes interlayer polymer diffusion as shown by the increased neck width between layers.

Originality/value

Thermocouples that are sandwiched between layers are used to achieve accurate measurement of the interfacial temperature. The temperature profiles under pre-deposition heating are analyzed and correlated to the interlayer bonding strengths.

Keywords

Citation

Mundada, P.S., Yang, C.-H. and Chen, R.K. (2023), "Investigation of the effects of a pre-deposition heating system on the interfacial temperature and interlayer bonding strength for fused filament fabrication", Rapid Prototyping Journal, Vol. 29 No. 1, pp. 9-18. https://doi.org/10.1108/RPJ-02-2021-0033

Publisher

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Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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