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Effects of rotation, voids and diffusion on characteristics of plane waves in a thermoelastic material

Baljeet Singh (Department of Mathematics, Post Graduate Government College, Chandigarh, India)
Himanshu Singla (Department of Mathematics, Panjab University, Chandigarh, India)

Multidiscipline Modeling in Materials and Structures

ISSN: 1573-6105

Article publication date: 11 September 2019

Issue publication date: 15 January 2020

59

Abstract

Purpose

The purpose of this paper is to study the effects of rotation, voids and diffusion on characteristics of plane waves in a thermoelastic material.

Design/methodology/approach

Lord and Shulman generalization of linear thermoelasticity is used to study the plane waves in a rotating thermoelastic material with voids and diffusion. The thermoelastic solid is rotating with a uniform angular velocity. The problem is specialized in two dimensions to study wave propagation. The plane harmonic solutions of governing field equations in a plane are obtained.

Findings

A velocity equation is obtained which indicates the propagation of five coupled plane waves in the medium. Reflection of an incident plane wave from stress-free surface of a half-space is also considered to obtain the amplitude ratios of various reflected waves. A numerical example is considered to illustrate graphically the effects of rotation, frequency, void and diffusion parameters on speeds and amplitude ratios of plane waves.

Originality/value

The present problem covers the combined effects of rotation, voids and diffusion on characteristics of plane waves in linear thermoelastic material in the context of Lord and Shulman (1967) and Aouadi (2010) theories, which are not studied in literature yet.

Keywords

Citation

Singh, B. and Singla, H. (2020), "Effects of rotation, voids and diffusion on characteristics of plane waves in a thermoelastic material", Multidiscipline Modeling in Materials and Structures, Vol. 16 No. 1, pp. 73-92. https://doi.org/10.1108/MMMS-12-2018-0210

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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