Numerical study of thermal radiation and suction effects on copper and silver water nanofluids past a vertical Riga plate

Abstract

Purpose

The purpose of this paper is to explore the flow of Cu-water and Ag-water nanofluids past a vertical Riga plate. The plate is infinite in height and has zero normal wall flux through its surface. Influence of thermal radiation, slip, suction and chemical reaction on the flow characteristics are reported.

Design/methodology/approach

Non-dimensional forms of the flow governing equations are obtained by means of a set of similarity transformations. Numerical solution is obtained with the help of fourth-fifth-order Runge–Kutta–Fehlberg method with shooting procedure. Comparison of solution profiles of Cu-water and Ag-water nanofluids are presented graphically and with the help of tables. Influence of pertinent parameters on skin friction and heat transfer rate is also reported.

Findings

Results reveal that the skin friction coefficient is more prominent in the case of Ag-water nanofluid for an increase in thermal radiation and volume fraction. The role of suction and slip is to increase velocity but decrease the temperature in both nanofluids. Temperature and velocity of both nanofluids increase as volume fraction and thermal radiation values are augmented. Heat transport increases with thermal radiation. Region near the plate experiences rise in nanoparticle concentration with an increase in chemical reaction parameter.

Originality/value

A complete investigation of the modeled problem is addressed and the results of this paper are original.

Citation

Rawat, S.K., Mishra, A. and Kumar, M. (2019), "Numerical study of thermal radiation and suction effects on copper and silver water nanofluids past a vertical Riga plate", Multidiscipline Modeling in Materials and Structures, Vol. 15 No. 4, pp. 714-736. https://doi.org/10.1108/MMMS-07-2018-0129