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Effect of non-uniform heat source/sink on MHD boundary layer flow and melting heat transfer of Williamson nanofluid in porous medium

Jayarami Reddy Konda (Mathematics Department, Koneru Lakshmaiah Education Foundation, Guntur, India)
Madhusudhana Reddy N.P. (Department of Mathematics, KLM College of Engineering for Women, Kadapa, India)
Ramakrishna Konijeti (Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Guntur, India)
Abhishek Dasore (Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Guntur, India)

Multidiscipline Modeling in Materials and Structures

ISSN: 1573-6105

Article publication date: 29 November 2018

Issue publication date: 21 February 2019

102

Abstract

Purpose

The purpose of this paper is to examine the influence of magnetic field on Williamson nanofluid embedded in a porous medium in the presence of non-uniform heat source/sink, chemical reaction and thermal radiation effects.

Design/methodology/approach

The governing physical problem is presented using the traditional Navier–Stokes theory. Consequential system of equations is transformed into a set of non-linear ordinary differential equations by means of scaling group of transformation, which are solved using the Runge–Kutta–Fehlberg method.

Findings

The working fluid is examined for several sundry parameters graphically and in a tabular form. It is noticed that with an increase in Eckert number, there is an increase in velocity and temperature along with a decrease in shear stress and heat transfer rate.

Originality/value

A good agreement of the present results has been observed by comparing with the existing literature results.

Keywords

Citation

Konda, J.R., N.P., M.R., Konijeti, R. and Dasore, A. (2019), "Effect of non-uniform heat source/sink on MHD boundary layer flow and melting heat transfer of Williamson nanofluid in porous medium", Multidiscipline Modeling in Materials and Structures, Vol. 15 No. 2, pp. 452-472. https://doi.org/10.1108/MMMS-01-2018-0011

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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