Finite element model updating of board-level electronic packages by factorial analysis and modal measurements
Abstract
Purpose
One difficultly in building an effective finite element (FE) model of a board-level package is because of complex structure of the printed circuit board (PCB), as it contains copper layers, woven fabrics, plated-through holes and so forth. Therefore, it is often acceptable to obtain equivalent orthotropic material properties and use them in the simulation. This paper aims to provide a research methodology to produce equivalent FE models for board-level electronic packages.
Design/methodology/approach
In this methodology, the FE models’ data were correlated with experimental modal analysis results in terms of natural frequencies and mode shapes. Statistical factorial analysis was used to examine the electronic assembly material properties effect on the structure’s resonant frequencies. The equivalent material properties of the PCB were adjusted using the optimization tool available in ANSYS software for free boundary conditions. The equivalent FE model was then validated for the fixed boundary conditions.
Findings
The resultant FE models were in great match with the measured data in terms of resonant frequencies and mode shapes. The so-developed models can be further used in the analysis of the dynamic response of the electronic packages and solder interconnects.
Originality/value
The current approach provides a sophisticated research methodology to provide high-accuracy FE models of electronic assemblies subjected to vibration. The main value of this approach is to first test the effect of each material property on the package dynamic characteristics before starting the correlation process, then to automate the correlation algorithm using the built-in FE model updating feature available in ANSYS software.
Keywords
Acknowledgements
The author would like to acknowledge the deanship of scientific research at The Hashemite University for the financial support of this study. Also, the author thanks Binghamton University for their willingness to use their research labs to conduct the current wok.
The author wishes to sincerely thank Professor Quang T. Su from the Department of Mechanical Engineering of State University of New York at Binghamton for his precious help and superior guidance throughout this research. Also, special thanks go to the Deanship of Scientific Research at the Hashemite University for providing necessary tools to complete this work.
Citation
Gharaibeh, M. (2018), "Finite element model updating of board-level electronic packages by factorial analysis and modal measurements", Microelectronics International, Vol. 35 No. 2, pp. 74-84. https://doi.org/10.1108/MI-12-2016-0086
Publisher
:Emerald Publishing Limited
Copyright © 2018, Emerald Publishing Limited