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Dynamic reliability approach of chip scale package assembly under vibration environment

Ping Yang (Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, People's Republic of China)
Xiusheng Tang (Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, People's Republic of China)
Yu Liu (Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, People's Republic of China)
Shuting Wang (School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, People's Republic of China, and)
Jianming Yang (Faculty of Engineering and Applied Science, Memorial University of Newfoundland St John's, Newfoundland, Canada)

Microelectronics International

ISSN: 1356-5362

Article publication date: 29 April 2014

290

Abstract

Purpose

The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided.

Design/methodology/approach

The CSP assembly which contains different package structure modes and chip positions was manufactured. The fatigue characteristics of CSP assembly under vibration were tested. The fatigue load spectrum of CSP assembly was developed under different excitation. The fatigue life of chips can be estimated by using the high-cycle fatigue life formula based on different stress conditions. The signal–noise curve shows the relationship between fatigue life and key factors. The design strategy for improving the fatigue life of CSP assembly was discussed.

Findings

The CSP chip has longer fatigue life than the ball grid array chip under high cyclic strain. The closer to fixed point the CSP chip, the longer fatigue life chips will have. The chip at the edge of the printed circuit board (PCB) has longer fatigue life than the one in the middle of the PCB. The greater the excitation imposed on the assembly, the shorter the fatigue life of chip.

Research limitations/implications

It is very difficult to set up a numerical approach to illustrate the validity of the testing approach because of the complex loading modes and the complex structure of CSP assembly. The research on an accurate mathematical model of the CSP assembly prototype is a future work.

Practical implications

It builds a basis for high reliability design of high-density CSP assembly for engineering application. In addition, vibration fatigue life prediction method of chip-corner solder balls is deduced based on three-band technology and cumulative damage theory under random vibration so as to verify the accuracy of experimental data.

Originality/value

This paper fulfils useful information about the dynamic reliability of CSP assembly with different structural characteristics and material parameters.

Keywords

Acknowledgements

The authors would like to acknowledge the support of the National Natural Science Foundation of China (61076098), the Innovative Foundation for Doctoral Candidate of Jiangsu Province (CXLX12_0622 and CXZZ13_0655), the Natural Science Foundation of Gangxi Advanced Manufacturing Key Laboratory (13-051-09-013K) and the Special Natural Science Foundation for Innovative Group of Jiangsu University during the course of this work.

Citation

Yang, P., Tang, X., Liu, Y., Wang, S. and Yang, J. (2014), "Dynamic reliability approach of chip scale package assembly under vibration environment", Microelectronics International, Vol. 31 No. 2, pp. 71-77. https://doi.org/10.1108/MI-11-2013-0061

Publisher

:

Emerald Group Publishing Limited

Copyright © 2014, Emerald Group Publishing Limited

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