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Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

Dongbo Li (Key Laboratory of Safety Design and Reliability Technology for Engineering Vehicle, Hunan Province, College of Automotive and Mechanical Engineering, Changsha University of Science and Technology, Changsha, China and Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/OEDS, Jiangsu University, Zhenjiang, P.R. China)
Jianpei Wang (Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/OEDS, Jiangsu University, Zhenjiang, P.R. China)
Bing Yang (Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/OEDS, Jiangsu University, Zhenjiang, P.R. China)
Yongle Hu (Key Laboratory of Safety Design and Reliability Technology for Engineering Vehicle, Hunan Province, College of Automotive and Mechanical Engineering, Changsha University of Science and Technology, Changsha, China)
Ping Yang (Key Laboratory of Safety Design and Reliability Technology for Engineering Vehicle, Hunan Province, College of Automotive and Mechanical Engineering, Changsha University of Science and Technology, Changsha, China and Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/OEDS, Jiangsu University, Zhenjiang, P.R. China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 3 September 2020

Issue publication date: 29 September 2020

151

Abstract

Purpose

This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided.

Design/methodology/approach

The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions.

Findings

The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring.

Originality/value

This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.

Keywords

Acknowledgements

The authors would like to acknowledge the support of National Natural Science Foundation of China (51575246, 61076098), the support of Six talent peaks project in Jiangsu Province(JXQC-006), the support of A Project Funded by the Priority Academic Program Development of Jiangsu Higher Education Institutions, Innovative Science Foundation for Graduate Students of Jiangsu Province (KYCX18_2225) and the High Performance Computing Platform of Jiangsu University during the course of this work.

Citation

Li, D., Wang, J., Yang, B., Hu, Y. and Yang, P. (2020), "Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load", Microelectronics International, Vol. 37 No. 4, pp. 165-171. https://doi.org/10.1108/MI-09-2019-0058

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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