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Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Chong Leong Gan (Spansion (Penang) Sdn Bhd, Penang, Malaysia)
Francis Classe (Spansion (Penang) Sdn Bhd, Penang, Malaysia)
Bak Lee Chan (Spansion (Penang) Sdn Bhd, Penang, Malaysia and Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, Kangar, Malaysia)
Uda Hashim (Spansion (Penang) Sdn Bhd, Penang, Malaysia and Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, Kangar, Malaysia)

Microelectronics International

ISSN: 1356-5362

Article publication date: 29 April 2014

589

Abstract

Purpose

The purpose of this paper is to provide a systematic review on technical findings and discuss the feasibility and future of gold (Au) wirebonding in microelectronics packaging. It also aims to study and compare the cost, quality and wear-out reliability performance of Au wirebonding with respect to other wire alloys such as copper (Cu) and silver (Ag) wirebonding. This paper discusses the influence of wire type on the long-term reliability tests.

Design/methodology/approach

Literature reviews are conducted based on cost and wire selections of Au, Cu or Ag wirebonding. Detailed wear-out failure findings and wire selection with cost considerations are presented in this review paper. The future and the status of Au wirebonding in microelectronics packaging are discussed in this paper.

Findings

This paper briefly reviews selected aspects of the Au ball and other alternative bonding options, focusing on reliability performance, and discusses the future of Au wirebonding in the near future in semiconductor packaging.

Practical implications

The paper reveals the technical considerations when choosing the wire types for future microelectronics packaging.

Originality/value

The in-depth technical review and strategies of the selection of wire types (Au, Cu or the latest Ag alloy) in microelectronics packaging are discussed in this paper based on previous literature studies.

Keywords

Acknowledgements

The authors would like to take this opportunity to thank Spansion management for their support of this publication.

Citation

Leong Gan, C., Classe, F., Lee Chan, B. and Hashim, U. (2014), "Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review", Microelectronics International, Vol. 31 No. 2, pp. 121-128. https://doi.org/10.1108/MI-07-2013-0036

Publisher

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Emerald Group Publishing Limited

Copyright © 2014, Emerald Group Publishing Limited

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