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W-band antenna in package module with hybrid glass-compound WLFO process

Gang Wang (Department of Advanced Manufacturing, Wuxi Zhong Wei High-tech Electronics Co., Ltd., Wuxi, China)
Chenhui Xia (Department of Advanced Manufacturing, Wuxi Zhong Wei High-tech Electronics Co., Ltd., Wuxi, China)
Bo Wang (Department of Advanced Manufacturing, Wuxi Zhong Wei High-tech Electronics Co., Ltd., Wuxi, China)
Xinran Zhao (Department of Advanced Manufacturing, Wuxi Zhong Wei High-tech Electronics Co., Ltd., Wuxi, China)
Yang Li (Department of Advanced Manufacturing, Wuxi Zhong Wei High-tech Electronics Co., Ltd., Wuxi, China)
Ning Yang (Microsystem Technology Centre, Information Science academy of CETC, Beijing, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 30 September 2022

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Abstract

Purpose

A W-band antennas-in-packages (AIP) module with a hybrid stacked glass-compound wafer level fan-out process was presented. Heterogeneous radio frequency (RF) chips were integrated into one single module with a microscale fan-out process. This paper aims to find a new strategy for 5G communication with 3D integration of multi-function chips.

Design/methodology/approach

The AIP module was composed of two stacked layers: the antenna layer and RF layer. After architecture design and performance simulation, the module was fabricated, The 8 × 8 antenna array was lithography patterned on the 12 inch glass wafer to reduce the parasitic parameters effect, and the signal feeding interface was fabricated on the backside of the glass substrate.

Findings

AIP module demonstrates a size of 180 mm × 180mm × 1mm, and its function covers the complete RF front-end chain from the antenna to signal to process and can be applied in 5 G communication and automotive components.

Originality/value

With three RF multi-function chips and two through silicon via (TSV) chips were embedded in the 12 inch compound wafer through the fan-out packaging process; two layers were interconnected with TSV and re-distributed layers.

Keywords

Citation

Wang, G., Xia, C., Wang, B., Zhao, X., Li, Y. and Yang, N. (2022), "W-band antenna in package module with hybrid glass-compound WLFO process", Microelectronics International, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/MI-06-2022-0111

Publisher

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Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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