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Modelling mutual thermal coupling in LED modules

Krzysztof Górecki (Department of Marine Electronics, Gdynia Maritime University, Gdynia, Poland)
Przemysław Ptak (Department of Marine Electronics, Gdynia Maritime University, Gdynia, Poland)

Microelectronics International

ISSN: 1356-5362

Article publication date: 3 August 2015

99

Abstract

Purpose

The purpose of this paper is to present an electrothermal model of the module containing power light emitting diodes (LEDs) situated on a common base.

Design/methodology/approach

The electrothermal model of this device, which takes into account both self-heating and mutual thermal coupling between the diodes situated in this module, is described.

Findings

The correctness of the presented model is verified experimentally, and a good agreement of the calculated and measured optical and thermal characteristics of the considered module is obtained.

Research limitations/implications

The presented model can be used for different structures of the LED module, but electrical inertia in the diodes is omitted.

Practical implications

The presented model was used to calculate electrical, thermal and optical waveforms of the module OSPR3XW1 containing three power LED situated on the common base.

Originality/value

The presented model takes into account thermal inertia in the considered LED module and its cooling systems with mutual thermal coupling between all the diodes situated in the same module.

Keywords

Citation

Górecki, K. and Ptak, P. (2015), "Modelling mutual thermal coupling in LED modules", Microelectronics International, Vol. 32 No. 3, pp. 152-157. https://doi.org/10.1108/MI-01-2015-0013

Publisher

:

Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited

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