To read the full version of this content please select one of the options below:

Intra‐ASEAN student mobility: overview, challenges and opportunities

Roger Yap Chao Jr. ( International Education Development Consultant , Hong Kong, Hong Kong)

Journal of Applied Research in Higher Education

ISSN: 2050-7003

Article publication date: 7 April 2020

Downloads
149

Abstract

Purpose

This paper explores the issue of developing and enhancing intra-ASEAN international student mobility given the context of ASEAN integration, regionalization of ASEAN higher education and the various intra‐ASEAN student mobility schemes currently implemented.

Design/methodology/approach

It explores higher education policies, available higher education and international student mobility data, as well as the various intra‐ASEAN (and relevant) student mobility schemes to present the current status of intra‐ASEAN student mobility, challenges and opportunities to further enhance student mobility within the ASEAN region.

Findings

Aside from showing that intra‐ASEAN student mobility is significantly low compared to outbound student mobility from ASEAN countries, the paper also highlights the relationship between a country’s income status with choice of intra‐ASEAN or extraASEAN student mobility. Finally, it recommends developing a comprehensive intra‐ASEAN mobility scheme taking the merits of the various intra‐ASEAN mobility schemes currently implemented and guided by developments in the European ERASMUS mobility programs.

Originality/value

This is probably the first (in fact, it is an exploratory) paper that address the issue of intra‐ASEAN international student mobility, which aims to explore relevant issues to address the development of a comprehensive ASEAN mobility scheme.

Keywords

Citation

Chao, R.Y. (2020), "Intra‐ASEAN student mobility: overview, challenges and opportunities", Journal of Applied Research in Higher Education, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/JARHE-07-2019-0178

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited