3D foot and shoe matching based on OBB and AABB

Zhong Li (Zhejiang Sci-Tech University, Hangzhou, China)
Liang Li (Zhejiang Sci-Tech University, Hangzhou, China)
Fengyuan Zou (Zhejiang Sci-Tech University, Hangzhou, China)
Yunchu Yang (Zhejiang Sci-Tech University, Hangzhou, China)

International Journal of Clothing Science and Technology

ISSN: 0955-6222

Publication date: 11 November 2013

Abstract

Purpose

The purpose of this paper is to present a novel method of 3D foot and shoe model matching based on oriented bounding box (OBB) and axis-aligned bounding box (AABB).

Design/methodology/approach

The paper first calculates their OBBs of foot and shoe models; aligns three axial directions of their OBBs to be parallel to three axes of world coordinate system. Then, computes their AABBs of foot and shoe models, translates the center of the bottom face of the foot's AABB to that of the shoe's AABB.

Findings

After the matching, the shoe model could be larger or locally smaller than the foot model. The paper finally adjusts the size of shoe model according to the distance difference.

Originality/value

Experimental results show that this method is simple and feasible which can effectively realize the matching between foot and shoe models.

Keywords

Acknowledgements

This research was supported by National Natural Science Foundation of China (No. 60903143, 50705089 and 51075421), Natural Science Foundation of Zhejiang Province of China (No. Y1110504), Qianjiang Talent Project of Zhejiang Province of China (No. QJD0902006); Science and Technology Project of Zhejiang Province of China (No. 2012C21035), Young Researchers Foundation of Zhejiang Provincial Top Key Academic Discipline of Mechanical Design and Theory and Zhejiang Sci-Tech University Key Laboratory (ZSTUMD2011B004) and Project of Zhejiang Provincial Research Center of Clothing Engineering Technology (2012003).

Citation

Li, Z., Li, L., Zou, F. and Yang, Y. (2013), "3D foot and shoe matching based on OBB and AABB", International Journal of Clothing Science and Technology, Vol. 25 No. 5, pp. 389-399. https://doi.org/10.1108/IJCST-Jul-2012-0044

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited

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