Study on the thermal-moisture comfort of knitted upper fabric with the foot model

Abstract

Purpose

The purpose of this paper is to measure the thermal and moisture resistance of the knitted upper fabrics with the foot model, which provided basis for designing and producing sports shoes with thermal-moisture comfort.

Design/methodology/approach

In this paper, different yarn materials and fabric stitches were selected as the changing factors. The three kinds of yarn materials and the three kinds of fabric stitches were combined to design and weave eight pieces of knitted upper fabrics. Human sweating was simulated by the thermal-moisture comfort foot model, and then tested the thermal and moisture resistance of eight pieces of fabrics in different parts of the foot. Finally, the relationship between yarn material, fabric stitch, and the thermal and moisture resistance in different parts of the foot was analyzed by data.

Findings

The composition of the yarn material and fabric stitch has certain effect on the thermal-moisture comfort in different sections of the foot. When the yarn material of the four parts of the lateral arch, medial arch, ankle and heel is composed of 31.1tex moisture wicking polyester/33.3tex spandex coated yarn, the yarn material of the instep and toes is composed of 31.1tex ordinary polyester/33.3tex spandex coated yarn, and all parts of fabric stitch choose single-sided loop transfer stitch, the knitted sports shoes have the best thermal-moisture comfort.

Originality/value

The study used the thermal-moisture comfort foot model to simulate the human body metabolism and sweating system. Through the quantitative analyze of the thermal and moisture resistance of knitted upper fabrics to provide basis for the producers to design and product knitted sports shoes with good thermal-moisture comfort.

Citation

Jin, Z., Lei, L., Meng, H., Gao, L. and Yan, Y. (2018), "Study on the thermal-moisture comfort of knitted upper fabric with the foot model", International Journal of Clothing Science and Technology, Vol. 30 No. 5, pp. 726-734. https://doi.org/10.1108/IJCST-11-2017-0177