High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)
Article publication date: 1 December 2001
A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build‐up process. The main characteristics of the laminate core substrate are the z‐axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.
Beyne, E., Van Hoof, R., Webers, T., Brebels, S., Rossi, S., Lechleiter, F., Di Ianni, M. and Ostmann, A. (2001), "High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)", Microelectronics International, Vol. 18 No. 3, pp. 36-42. https://doi.org/10.1108/EUM0000000005830
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