Development of a new, more efficient and environmentally friendly method of producing high density interconnects – the “PRIME” process

Abstract

In September 1998 six European companies involved in PCB manufacturing and electronic packaging started collaborating in a development project known as “PRIME”. The “Program for Re‐engineering and Innovating (PCB) Manufacturing and Equipment” project lost one of its original members in late 1999, and Coates Circuit Products joined as the dielectric supplier. The project is now approaching the mid‐term assessment (MTA), where alternative production scenarios will be discussed and the most attractive carried forward to fabricate test vehicles and ultimately demonstrator patterns. Some essential features of the project have already been demonstrated and these initial results will be presented.

Citation

Albin, D., Rames, J., Dietel, C., Lenfert, K., Rossi, S., Starkey, D., Down, J., Pineda, R., Carlos Sardon, J., Goosey, M., Graves, J., Bains, N., Cristoph, F., Smeets, F. and Gilen, W. (2001), "Development of a new, more efficient and environmentally friendly method of producing high density interconnects – the “PRIME” process", Circuit World, Vol. 27 No. 2, pp. 12-16. https://doi.org/10.1108/EUM0000000005400