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Evode – fighting solvent abuse

Mike Cook (Evode Limited)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 December 1994

213

Abstract

Looks at the increasing pressure from both environmental and health and safety aspects to overcome the problems associated with solvent‐based adhesives and comply with current and proposed legislation. Discusses the four basic solutions of using solvent containment, safe and environmentally‐friendly solvents, high solids systems and solvent‐free adhesives. Concludes that the long‐term option is solvent‐free systems such as water based, hot‐melt and liquid reactive adhesives, but substantial advances in technology are required if they are to make major inroads in the solvent‐based adhesive market.

Keywords

Citation

Cook, M. (1994), "Evode – fighting solvent abuse", Assembly Automation, Vol. 14 No. 4, pp. 29-31. https://doi.org/10.1108/EUM0000000004217

Publisher

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MCB UP Ltd

Copyright © 1994, MCB UP Limited

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