Is it always this cold? Chilly interpersonal climates as a barrier to the well-being of early-career women faculty in STEM
Equality, Diversity and Inclusion
ISSN: 2040-7149
Article publication date: 10 January 2019
Issue publication date: 26 February 2019
Abstract
Purpose
The purpose of this project was to examine the extent to which early-career women faculty in science, technology, engineering and math (STEM) experience working in a chilly interpersonal climate (as indicated by experiences of ostracism and incivility) and how those experiences relate to work and non-work well-being outcomes.
Design/methodology/approach
Data came from a sample of 96 early-career STEM faculty (Study 1) and a sample of 68 early-career women STEM faculty (Study 2). Both samples completed online surveys assessing their experiences of working in a chilly interpersonal climate and well-being.
Findings
In Study 1, early-career women STEM faculty reported greater experiences of ostracism and incivility and more negative occupational well-being outcomes associated with these experiences compared to early-career men STEM faculty. In Study 2, early-career women STEM faculty reported more ostracism and incivility from their male colleagues than from their female colleagues. Experiences of ostracism (and, to a lesser extent, incivility) from male colleagues also related to negative occupational and psychological well-being outcomes.
Originality/value
This paper documents that exposure to a chilly interpersonal climate in the form of ostracism and incivility is a potential explanation for the lack and withdrawal of junior women faculty in STEM academic fields.
Keywords
Acknowledgements
This project was funded by the National Science Foundation under NSF Cooperative Agreement No. HRD-1008385.
Citation
Miner, K.N., January, S.C., Dray, K.K. and Carter-Sowell, A.R. (2019), "Is it always this cold? Chilly interpersonal climates as a barrier to the well-being of early-career women faculty in STEM", Equality, Diversity and Inclusion, Vol. 38 No. 2, pp. 226-245. https://doi.org/10.1108/EDI-07-2018-0127
Publisher
:Emerald Publishing Limited
Copyright © 2019, Emerald Publishing Limited