Effects of additives on via filling and pattern plating with simultaneous electroplating

Abstract

Purpose

The purpose of this paper is to solve the issue of via filling and pattern plating simultaneously by concentration optimization of accelerator and leveler in the electroplating bath.

Design/methodology/approach

This paper designs a series of experiments to verify the performance of pattern plating with the via filling plating formula. Then the compositions of electroplating solution are optimized to achieve via filling and pattern plating simultaneously. Finally, the mechanism of co-plating for via and line is discussed in brief.

Findings

To achieve excellent performance for via filling and pattern plating simultaneously, proportion of additives are comprehensively considered in optimization of electroplating process. Effects of additives on the via filling and pattern plating should be taken into consideration, especially in achieving flat lines.

Originality/value

This paper discusses the different effects of accelerator and leveler on the via filling and the pattern plating, respectively. The process of co-plating for the via and the line is presented. The superfilling of via and the flat line are simultaneously obtained with the optimized via filling formula.

Citation

Sun, Z. and Wang, J. (2023), "Effects of additives on via filling and pattern plating with simultaneous electroplating", Circuit World, Vol. 49 No. 2, pp. 105-112. https://doi.org/10.1108/CW-12-2020-0335