Technological aspects of silver particle sintering for electronic packaging

Abstract

Purpose

This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging.

Design/methodology/approach

Based on the literature and author’s own experience, the factors influencing the nanosized Ag particle sintering results were identified, and their significance was assessed.

Findings

It has been shown that some important technological parameters clearly influence the quality of the joints, and their choice is unambiguous, but the meaning of some parameters is dependent on other factors (interactions), and they should be selected experimentally.

Originality/value

The value of this research is that the importance of all technological factors was analyzed, which makes it easy to choose the technological procedures in the electronic packaging.

Citation

Felba, J. (2018), "Technological aspects of silver particle sintering for electronic packaging", Circuit World, Vol. 44 No. 1, pp. 2-15. https://doi.org/10.1108/CW-10-2017-0060