TY  - JOUR
AB  - Purpose The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor.Design/methodology/approach The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints.Findings The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease.Originality/value The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.
VL  - 44
IS  - 1
SN  - 0305-6120
DO  - 10.1108/CW-10-2017-0059
UR  - https://doi.org/10.1108/CW-10-2017-0059
AU  - Veselý Petr
AU  - Horynová Eva
AU  - Starý Jiří
AU  - Bušek David
AU  - Dušek Karel
AU  - Zahradník Vít
AU  - Plaček Martin
AU  - Mach Pavel
AU  - Kučírek Martin
AU  - Ježek Vladimír
AU  - Dosedla Milan
PY  - 2018
Y1  - 2018/01/01
TI  - Solder joint quality evaluation based on heating factor
T2  - Circuit World
PB  - Emerald Publishing Limited
SP  - 37
EP  - 44
Y2  - 2024/04/17
ER  -