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Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Aneta Arazna (Tele and Radio Research Institute, Warsaw, Poland)
Kamil Janeczek (Tele and Radio Research Institute, Warsaw, Poland)
Konrad Futera (Centre for Advanced Technology Warsaw, Tele and Radio Research Institute, Warsaw, Poland)

Circuit World

ISSN: 0305-6120

Article publication date: 6 February 2017

284

Abstract

Purpose

This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink.

Design/methodology/approach

Fully inkjet-printed conductive circuit tracks were printed on a flexible, transparent KAPTON foil, using a commercial 40LT-15 C nanosilver ink as well as a PixDro LP50 inkjet printer with KonicaMinnolta 512 printhead. After cure, electrical properties by resistance measurements and printing quality by optical and SEM microscopic observation of conductive tracks were examined. Afterwards, the tested samples were annealed for 1, 2 and 3 h at 150°C or subjected to cycling bending.

Findings

It was found that silver nanoparticles ink could be used for the preparation of electronic circuits using the inkjet printing technique. The obtained patterns had appropriate mapping and good quality. It was also noticed that thermal annealing caused a decrease in resistivity values of the tested lines irrespective of their width. Approximately 34 per cent decrease was achieved in the values of resistivity of all the tested lines after the first hour of thermal annealing. After the second hour, the values of resistivity decreased by another 50 per cent. There were no visible changes in resistivity values after 1,000 cycles of bending.

Originality/value

In this paper, the results of thermal annealing and bending tests of inkjet-printed silver nanoparticle conductive tracks on flexible substrate were presented. That is very important information for producing printed circuit boards using ecological, rapid and low-cost inkjet printing techniques, particularly during the production of printed circuit boards on flexible substrates working in different conditions of mechanical and thermal stresses.

Keywords

Citation

Arazna, A., Janeczek, K. and Futera, K. (2017), "Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates", Circuit World, Vol. 43 No. 1, pp. 9-12. https://doi.org/10.1108/CW-10-2016-0047

Publisher

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Emerald Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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