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Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization

Shuo Xiao (School of Computer Science and Technology, China University of Mining and Technology, Xuzhou, China)
Yang Zhao (Department of Electronic and Information Technology, Jiangmen Polytechnic, Jiangmen, China)
Yuan Cao (School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China)
Haifeng Jiang (School of Computer Science and Technology, China University of Mining and Technology, Xuzhou, China)
Wenliang Zhu (College of Harbor Coastal and Offshore Engineering, Hohai University, Nanjing, China)

Circuit World

ISSN: 0305-6120

Article publication date: 2 February 2015

Abstract

Purpose

This paper aims to deduce a set of theory computational formula, and optimize and improve the heat conductivity of vias in printed circuit boards of electrical power apparatus.

Design/methodology/approach

The authors adopted numerical simulation and experimental measurement to verify the reliability of this formula.

Findings

Research result showed that 0.45 mm was the optimal bore diameter of vias; the conductivity had no obvious improvement when filling material was FR4 or Rogers, but if it was filled with texture of high thermal conductivity like soldering tine, the conductivity would improve a lot; the plating thickness of vias had a greater influence on thermal conductivity.

Originality/value

Through the theory computational formula, this paper studied the influence of aperture of vias, filled materials and thickness of copper plated on vias on thermal conductivity.

Keywords

Acknowledgements

The authors acknowledge Natural Science Foundation of Jiangsu Province (No. BK20140202) and National Science Foundation of China (51305021).

Citation

Xiao , S., Zhao , Y., Cao, Y., Jiang, H. and Zhu, W. (2015), "Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization", Circuit World, Vol. 41 No. 1, pp. 14-19. https://doi.org/10.1108/CW-10-2014-0043

Publisher

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Emerald Group Publishing Limited

Copyright © 2015, Emerald Group Publishing Limited